everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev. 1.0 page: 1 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou technical data sheet high power led ? 5w ehp-b03ls/ut04-p05/tr features z feature of the device: small package with high efficiency z typical color temperature: 6500 k. z view angle: 130. z typical light flux output: 190lm @ 700ma. z esd protection. z soldering methods: smt. z grouping parameter: total luminous flux, color temperature. z typical optical efficiency: 38 lm/w. z thermal resistance (junction to lead): 9 k/w. z the product itself will remain within rohs compliant version. descriptions z the series are specially designed for applications requiring higher brightness. z led should mount onto the aluminum-cored printed circuit board z allowing for cooling. applications z backlighting (illuminated advertising, general lighting) z reading lamps (aircraft, car, bus) z indoor and outdoor commercial and residential architectural lighting z decorative and entertainment lighting z signal and symbol luminaries for orientation z indication lights (e.g. steps, exit ways, etc.) materials items description housing black body(pcb) heat resistant polymer reflector heat resistant polymer heat sink copper encapsulating resin silicone resin lens heat resistant clear silicone electrodes ag plating copper alloy die attach silver paste chip ingan? blue
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev. 1.0 page: 2 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou ehp-b03ls/ut04-p05/tr package outline dimensions notes: 1. dimensions are in millimeters 2. tolerances unless dimensions 0.15mm
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 3 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou ehp-b03ls/ut04-p05/tr maximum ratings ( t ambient =25oc ) parameter symbol rating unit operating temperature t opr -40 ~ +80 oc storage temperature t stg -40 ~ +100 oc junction temperature t j 125 oc thermal resistance of junction to heat sink r th 11 k/w pulse forward current i f 1000 ma pulse power dissipation p d 7.5 w electro-optical characteristics ( t ambient =25oc ) parameter bin symbol min typ. max unit condition n1 130 ---- 160 n2 160 ---- 200 luminous flux (1) n3 v 200 ---- 250 lm forward voltage (2) v f 6.6 ---- 8.0 v viewing angle (3) ---- 2 1/2 ---- 130 ---- deg color temperature (4) cct 4500 6300 10000 k i f =700ma note. 1. luminous flux measurement tolerance : 10% 2. forward voltage measurement tolerance : 0.1v 3. 2 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 4. cct bin refer to document ?high power illumina tion emitters labeling and binning? of everlight.
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 4 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou relative spectral distribution i f =700ma , t a m b i e n t =25oc forward voltage vs forward current t a m b i e n t =25oc relative luminous intensity vs forward current t a m b i e n t =25oc 0 20406080100 0 100 200 300 400 500 600 700 800 forward current (ma) ambient temperature ( c ) forward current derating curve, deratin g based on t j max =125 c ehp-b03ls/ut04-p05/tr typical electro-optical curves 0 200 400 600 800 1000 5.0 5.5 6.0 6.5 7.0 7.5 forward voltage(v) forward current(ma) 0 200 400 600 800 1000 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 relative luiminous intensity forward current(ma) 400 450 500 550 600 650 700 750 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intensity wavelength (nm)
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 5 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou -80-60-40-20 0 20406080 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 relative luminous intensity degree ( 2 ) ehp-b03ls/ut04-p05/tr typical representative spatial radiation pattern
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 6 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou ehp-b03ls/ut04-p05/tr label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: ranks hue: peak wavelength ref: reference lot no: lot number made in taiwan: production place tube packing specifications reel dimensions
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 7 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou 16 0 2 4 24.0 11.5 10.4 59 ehp-b03ls/ut04-p05/tr carrier tape dimensions: loaded quantity 500 pcs per reel. note: 1. dimensions are in millimeters 2. the tolerances unless mentioned is 0.1mm moisture resistant packaging aluminum moistue-proof bag label desiccant label
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 8 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou ehp-b03ls/ut04-p05/tr reliability test items and results stress test stress condition stress duration solderability tsol=230 , 5sec 1 times reflow tsol=260 , 10sec, 6min 3 times thermal shock h 110 20min. ' 20sec. 'l 40 20min. 500 cycles temperature cycle h 100 30min. ' 5min. 'l 40 30min. 1000 cycles high temperature/humidity reverse bias ta=85 , rh=85% 1000hours high temperature storage ta= 110 1000hours low temperature storage ta= -40 1000hours low temperature operation life ta= -40 , if=700ma 1000hours power temperature cycle h 85 15min. ' 5min. 'l 40 15min. if= 225ma, 2min on/off 500cycles esd human body model 2000v, interval:0.5sec 3 times esd machine model 200v, interval:0.5sec 3 times *lm: brightness attenuate difference(1000hrs) 50% *vf: forward voltage difference 20%
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 9 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou ehp-b03ls/ut04-p05/tr precautions for use 1. over-current-proof though ehp-b03 has conducted esd protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. storage i. do not open moisture proof bag before the products are ready to use. ii. before opening the package, the leds should be kept at 30 or less and 90%rh or less. iii. the leds should be used within a year. iv. after opening the package, the leds should be kept at 30 or less and 70%rh or less. v. the leds should be used within 168 hours (7 days) after opening the package. vi. if the moisture absorbent material (silicone gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. vii. pre-curing treatment : 605 for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliability, ehp-a08 series led package should be mounted on a metal core printed circuit board (mcpcb) with proper thermal connection to dissipate approximately 1w of thermal energy under 350ma operation. ii. special thermal designs are also recommended to take in outer heat sink design, such as fr4 pcb on aluminum with thermal vias or fpc on al uminum with thermal conductive adhesive, etc. iii. sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and led lifetime will decrease critically.
everlight electronics co.,ltd. everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 10 of 10 device no. : prepared date: 08-20-2007 prepared by: brady chou ehp-b03ls/ut04-p05/tr 4. soldering condition i. lead reflow soldering temperature profile ii. reflow soldering should not be done more than two times. iii. while soldering, do not put stress on the leds during heating. iv. after soldering, do not warp the circuit board 5. soldering iron i. for prototype builds or small series production runs it is possible to place and solder the led by hand. ii. dispensing thermal conductive glue or grease on the substrates and follow its curing spec. press led housing to closely connect led and substrate. iii. it is recommended to hand solder the leads with a solder tip temperature of 280c for less than 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. iv. be careful because the damage of the product is often started at the time of the hand solder.
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